AS4C256M8D3-12BCN

Product Overview

Category

AS4C256M8D3-12BCN belongs to the category of dynamic random-access memory (DRAM) chips.

Use

It is primarily used as a storage component in electronic devices such as computers, smartphones, and tablets.

Characteristics

• AS4C256M8D3-12BCN is a high-density memory chip with a capacity of 256 megabits (32 megabytes).
• It operates at a speed of 12 nanoseconds, making it suitable for applications that require fast data access.
• The chip follows the DDR3 (Double Data Rate 3) standard, ensuring compatibility with DDR3-based systems.
• It has a low power consumption, making it energy-efficient.

Package

AS4C256M8D3-12BCN is available in a compact and standardized BGA (Ball Grid Array) package.

Essence

The essence of AS4C256M8D3-12BCN lies in its ability to store and retrieve data quickly, providing efficient memory management for electronic devices.

Packaging/Quantity

AS4C256M8D3-12BCN is typically packaged in reels or trays, with each reel or tray containing a specific quantity of chips. The exact packaging and quantity may vary depending on the manufacturer's specifications.

Specifications

• Memory Type: DDR3 SDRAM
• Capacity: 256 Megabits (32 Megabytes)
• Speed: 12 Nanoseconds
• Organization: 256M x 8 bits
• Voltage: 1.5V
• Interface: Parallel
• Operating Temperature: -40°C to +85°C
• Package Type: BGA

Detailed Pin Configuration

AS4C256M8D3-12BCN follows a standard pin configuration for DDR3 memory chips. The pinout diagram is as follows:

[Insert Pin Configuration Diagram Here]

Functional Features

• High-speed data access: AS4C256M8D3-12BCN offers fast read and write operations, enabling efficient data processing.
• Low power consumption: The chip is designed to minimize power usage, making it suitable for battery-powered devices.
• Compatibility: AS4C256M8D3-12BCN adheres to the DDR3 standard, ensuring compatibility with a wide range of systems.
• Reliability: It incorporates error correction techniques and advanced memory management features to enhance data integrity.

Advantages and Disadvantages

Advantages

• Fast data access speed
• Low power consumption
• High-density storage capacity
• Compatibility with DDR3-based systems
• Reliable data integrity

Disadvantages

• Limited capacity compared to higher-end memory chips
• Not compatible with older DDR2 or DDR1 systems

Working Principles

AS4C256M8D3-12BCN operates based on the principles of dynamic random-access memory (DRAM). It stores data in capacitors within its memory cells, which need to be periodically refreshed to maintain the stored information. When data is requested, the chip retrieves it by accessing the appropriate memory cells and transferring the data to the requesting device.

Detailed Application Field Plans

AS4C256M8D3-12BCN finds applications in various electronic devices that require high-speed and reliable data storage. Some potential application fields include: - Personal computers - Laptops and notebooks - Servers and data centers - Gaming consoles - Mobile devices (smartphones, tablets)

Detailed and Complete Alternative Models

• AS4C128M16D3-12BCN: 128 Megabit (16 Megabyte) capacity variant of the same DDR3 memory chip.
• AS4C512M8D3-12BCN: 512 Megabit (64 Megabyte) capacity variant of the same DDR3 memory chip.
• AS4C256M8D3-12BIN: Industrial-grade version of AS4C256M8D3-12BCN, designed for extended temperature ranges.

These alternative models offer different capacities or variations to suit specific requirements while maintaining compatibility with DDR3-based systems.

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