AS4C512M8D3B-12BINTR

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-speed performance
  • Low power consumption
  • Compact size
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Bulk packaging, typically sold in reels or trays

Specifications

• Part Number: AS4C512M8D3B-12BINTR
• Organization: 512 Megabit x 8
• Speed: 12ns (nanoseconds)
• Voltage: 3.3V (Volts)
• Interface: Parallel
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C512M8D3B-12BINTR has a total of 60 pins arranged as follows:

1. VDD (Power supply voltage)
2. VSS (Ground)
3. A0-A18 (Address inputs)
4. DQ0-DQ7 (Data inputs/outputs)
5. WE (Write Enable)
6. CAS (Column Address Strobe)
7. RAS (Row Address Strobe)
8. OE (Output Enable)
9. BA0-BA1 (Bank Address inputs)
10. CLK (Clock input)

... (detailed pin configuration continues)

Functional Features

• High-speed data access and transfer
• Non-volatile storage of data
• Easy integration with other ICs
• Low power consumption for energy efficiency
• Reliable and durable performance

Advantages

• Fast data processing and retrieval
• Suitable for various applications requiring high-speed memory
• Compact size allows for space-saving designs
• Low power consumption extends battery life in portable devices

Disadvantages

• Relatively higher cost compared to other memory technologies
• Limited storage capacity compared to non-volatile memory options

Working Principles

The AS4C512M8D3B-12BINTR is based on dynamic random access memory (DRAM) technology. It stores data in capacitors within each memory cell, which must be periodically refreshed to maintain the stored information. The memory cells are organized into rows and columns, allowing for efficient addressing and retrieval of data.

Detailed Application Field Plans

The AS4C512M8D3B-12BINTR is commonly used in various electronic devices and systems, including: - Personal computers - Laptops and notebooks - Servers and data centers - Networking equipment - Consumer electronics (e.g., smartphones, tablets) - Automotive electronics - Industrial control systems

Detailed and Complete Alternative Models

• AS4C256M16D3A-12BCN: 256 Megabit x 16, 12ns, BGA package
• AS4C128M32D3A-12BCN: 128 Megabit x 32, 12ns, BGA package
• AS4C64M64D3A-12BCN: 64 Megabit x 64, 12ns, BGA package
• AS4C32M128D3A-12BCN: 32 Megabit x 128, 12ns, BGA package

These alternative models offer different memory capacities and configurations while maintaining similar characteristics and performance.

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