BCP 54-16 H6778
Product Category: Transistor
Basic Information Overview: - Category: Bipolar Junction Transistor (BJT) - Use: Amplification and switching in electronic circuits - Characteristics: High current gain, low noise, and high frequency capability - Package: TO-220AB - Essence: Silicon NPN Epitaxial Planar Transistor - Packaging/Quantity: Typically sold in reels of 1000 units
Specifications: - Collector-Base Voltage (VCBO): 80V - Collector-Emitter Voltage (VCEO): 45V - Emitter-Base Voltage (VEBO): 6V - Collector Current (IC): 6A - Power Dissipation (PD): 40W - Transition Frequency (fT): 150MHz - Operating Temperature Range: -65°C to 150°C
Detailed Pin Configuration: - Pin 1 (Emitter): Connected to the emitter region of the transistor - Pin 2 (Base): Connected to the base region of the transistor - Pin 3 (Collector): Connected to the collector region of the transistor
Functional Features: - High current gain for amplification applications - Low noise characteristics suitable for signal processing - High frequency capability for RF applications
Advantages and Disadvantages: - Advantages: - High current gain allows for efficient amplification - Low noise makes it suitable for sensitive signal processing - High frequency capability enables use in RF circuits - Disadvantages: - Limited power dissipation compared to some alternative models - Relatively low collector-emitter voltage rating
Working Principles: The BCP 54-16 H6778 operates based on the principles of bipolar junction transistors, utilizing the interaction between minority and majority charge carriers in the semiconductor material to control current flow.
Detailed Application Field Plans: - Audio amplification circuits - Signal processing and conditioning - Radio frequency (RF) amplification
Detailed and Complete Alternative Models: - BC337-40 - 2N3904 - BC546B - 2N2222A
This comprehensive entry provides a detailed overview of the BCP 54-16 H6778 transistor, including its specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.
What is BCP 54-16 H6778?
What are the key features of BCP 54-16 H6778?
In what technical solutions is BCP 54-16 H6778 commonly used?
How does BCP 54-16 H6778 contribute to thermal management in electronic devices?
Is BCP 54-16 H6778 compatible with different manufacturing processes?
What are the recommended storage and handling guidelines for BCP 54-16 H6778?
Can BCP 54-16 H6778 be customized for specific technical requirements?
Does BCP 54-16 H6778 comply with industry standards and regulations?
What are the typical performance metrics for BCP 54-16 H6778 in technical solutions?
Are there any known limitations or precautions when using BCP 54-16 H6778 in technical solutions?