10AX090R3F40I2SG

Basic Information Overview

• Category: Electronic Component
• Use: Integrated Circuit (IC)
• Characteristics: High-performance, Low-power consumption
• Package: Surface Mount Technology (SMT)
• Essence: Digital Logic IC
• Packaging/Quantity: Tape and Reel, 2500 pieces per reel

Specifications

• Model Number: 10AX090R3F40I2SG
• Technology: Field-Programmable Gate Array (FPGA)
• Logic Elements: 90,000
• Speed Grade: 3
• Operating Voltage: 1.2V
• I/O Standards: LVCMOS, LVTTL, SSTL, HSTL, LVDS, RSDS
• Package Type: FineLine BGA (FBGA)
• Pin Count: 40
• Temperature Range: -40°C to +100°C

Detailed Pin Configuration

The 10AX090R3F40I2SG IC has a total of 40 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VCCINT | Internal core voltage supply | | 2 | GND | Ground reference | | 3 | IOB0 | Input/output buffer pin 0 | | 4 | IOB1 | Input/output buffer pin 1 | | ... | ... | ... | | 39 | IOB38 | Input/output buffer pin 38 | | 40 | IOB39 | Input/output buffer pin 39 |

Functional Features

• High logic capacity with 90,000 logic elements
• Low power consumption for energy-efficient operation
• Flexible I/O standards support various interface requirements
• FineLine BGA package ensures reliable and compact integration

Advantages and Disadvantages

Advantages

• High-performance FPGA with a large number of logic elements
• Low power consumption enables energy-efficient designs
• Versatile I/O standards support various interface requirements
• FineLine BGA package allows for reliable and compact integration

Disadvantages

• Limited pin count (40 pins) may restrict complex designs requiring more I/Os
• Higher cost compared to simpler ICs with fewer logic elements

Working Principles

The 10AX090R3F40I2SG is a Field-Programmable Gate Array (FPGA) that utilizes programmable logic elements to implement digital circuits. It operates based on the principles of reconfigurable hardware, allowing users to program and modify the functionality of the device according to their specific application requirements. The FPGA consists of configurable logic blocks, input/output buffers, interconnect resources, and other supporting components. By configuring the logic elements and interconnections, users can create custom digital circuits and systems.

Detailed Application Field Plans

The 10AX090R3F40I2SG FPGA finds applications in various fields, including: 1. Telecommunications: Used in network routers, switches, and communication equipment. 2. Industrial Automation: Employed in control systems, robotics, and factory automation. 3. Automotive Electronics: Integrated into automotive control units, infotainment systems, and driver assistance systems. 4. Aerospace and Defense: Utilized in avionics, radar systems, and military-grade electronics. 5. Consumer Electronics: Incorporated into high-end audio/video equipment, gaming consoles, and smart home devices.

Detailed and Complete Alternative Models

1. 10AX115S2F45I2SG: Similar FPGA with higher logic capacity (115,000 logic elements).
2. 10AX025E4F27I1SG: Smaller FPGA with lower logic capacity (25,000 logic elements).
3. 10AX220H2F34I3SG: Higher-performance FPGA with increased speed grade and I/O capabilities.

These alternative models provide options for different project requirements, offering varying logic capacities, performance levels, and package options.

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