EP2AGX260FF35I3

Product Overview

• Category: Integrated Circuit (IC)
• Use: Programmable Logic Device (PLD)
• Characteristics: High-performance, low-power consumption
• Package: Flip-chip BGA (Ball Grid Array)
• Essence: Field-Programmable Gate Array (FPGA)
• Packaging/Quantity: Single unit

Specifications

• Manufacturer: Intel Corporation
• Technology: 20 nm
• Logic Elements: 260,000
• Embedded Memory: 1,638 Kbits
• Maximum User I/Os: 622
• Operating Voltage: 1.2V
• Operating Temperature: -40°C to +100°C
• Speed Grade: 3

Detailed Pin Configuration

The EP2AGX260FF35I3 has a complex pin configuration with multiple pins dedicated to various functions. The detailed pin configuration can be found in the manufacturer's datasheet.

Functional Features

• High-performance FPGA with advanced logic elements
• Low-power consumption for energy-efficient applications
• Flexible and reprogrammable design for customization
• Embedded memory for data storage
• Wide range of I/O options for versatile connectivity
• Support for various communication protocols
• Built-in security features for data protection

Advantages and Disadvantages

Advantages

• High-performance capabilities suitable for demanding applications
• Low-power consumption for energy efficiency
• Flexibility and reprogrammability allow for customization
• Embedded memory provides on-chip data storage
• Versatile I/O options enable seamless connectivity
• Security features ensure data protection

Disadvantages

• Complex pin configuration may require careful planning and design
• Limited availability of alternative models from other manufacturers
• Higher cost compared to simpler programmable logic devices

Working Principles

The EP2AGX260FF35I3 is based on the Field-Programmable Gate Array (FPGA) technology. It consists of a large number of configurable logic elements interconnected through programmable routing resources. These logic elements can be programmed to implement various digital functions, making the FPGA highly versatile and adaptable.

The device operates by configuring the interconnections and functionality of its logic elements using a hardware description language (HDL). The configuration data is stored in non-volatile memory within the FPGA, allowing it to retain the programmed design even after power is removed.

During operation, the FPGA executes the programmed logic, enabling it to perform complex tasks such as data processing, signal generation, and control functions.

Detailed Application Field Plans

The EP2AGX260FF35I3 finds applications in various fields that require high-performance and customizable digital logic. Some of the common application areas include:

1. Communications: Used in networking equipment, routers, and switches for high-speed data processing and packet forwarding.
2. Industrial Automation: Employed in industrial control systems, robotics, and factory automation for real-time control and monitoring.
3. Medical Devices: Integrated into medical imaging systems, patient monitoring devices, and diagnostic equipment for data processing and analysis.
4. Aerospace and Defense: Utilized in radar systems, avionics, and military communication systems for high-speed signal processing and encryption.
5. Automotive: Incorporated into advanced driver-assistance systems (ADAS), infotainment systems, and engine control units (ECUs) for enhanced performance and functionality.

Detailed and Complete Alternative Models

While the EP2AGX260FF35I3 is a highly capable FPGA, there are alternative models available from other manufacturers that offer similar features. Some notable alternatives include:

1. Xilinx Virtex UltraScale+ VU9P
2. Lattice Semiconductor ECP5-85
3. Microchip PolarFire FPGA

These alternative models provide comparable performance and functionality, allowing designers to choose the most suitable option for their specific application requirements.

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