EPF10K130EFC484-3

Basic Information Overview

• Category: Programmable Logic Device (PLD)
• Use: EPF10K130EFC484-3 is a PLD used for digital logic applications.
• Characteristics:
  • High-density programmable logic device
  • Advanced CMOS technology
  • Low power consumption
  • Fast performance
• Package: The EPF10K130EFC484-3 comes in a 484-pin FineLine BGA package.
• Essence: EPF10K130EFC484-3 is designed to provide flexible and efficient digital logic implementation.
• Packaging/Quantity: The product is typically sold individually, and the packaging quantity depends on the supplier.

Specifications

• Logic Elements: 131,072
• Maximum User I/Os: 316
• Embedded Memory: 1,152 Kbits
• Maximum Operating Frequency: 250 MHz
• Supply Voltage: 3.3V
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The EPF10K130EFC484-3 has a total of 484 pins. The pin configuration includes input/output pins, power supply pins, ground pins, and configuration pins. A detailed pinout diagram can be found in the product datasheet.

Functional Features

• High-density programmable logic elements allow for complex digital designs.
• Flexible I/O options enable connectivity with external devices.
• Embedded memory provides additional storage for data processing.
• Fast operating frequency allows for real-time applications.
• Low power consumption ensures energy efficiency.

Advantages

• High-density design enables the implementation of complex digital circuits.
• Flexible I/O options provide versatility in connecting with external devices.
• Advanced CMOS technology offers fast performance and low power consumption.
• Large embedded memory allows for efficient data processing.

Disadvantages

• Limited number of user I/Os may restrict the connectivity options for certain applications.
• The fine pitch of the BGA package may require specialized equipment for soldering and rework.

Working Principles

The EPF10K130EFC484-3 is based on programmable logic technology. It consists of a matrix of programmable logic elements interconnected through configurable routing resources. The device can be programmed to implement various digital logic functions by configuring the interconnections between logic elements.

Detailed Application Field Plans

The EPF10K130EFC484-3 is widely used in various digital logic applications, including: - Industrial automation - Communication systems - Consumer electronics - Automotive electronics - Medical devices

Detailed and Complete Alternative Models

• EPF10K50SFC256-2: A lower-density version with 50,000 logic elements and 256-pin package.
• EPF10K200SFC672-1: A higher-density version with 200,000 logic elements and 672-pin package.
• EPF10K400SFC896-3: An even higher-density version with 400,000 logic elements and 896-pin package.

These alternative models offer different levels of logic density and pin configurations to cater to specific application requirements.

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